And now, brethren, I wot that through ignorance ye did it, as did also your rulers.

He had spoken through ignorance and malice.

他曾充满蔑视和恶意地说过。

If he did wrong it was only through ignorance.

要是他做错了，那也只是出於无知。

Writers can't blufftheir way through ignorance.

"作家不能通过无知来虚张声势。"

The librarian had spoken through ignorance or malice.

图书管理员讲这样的话是出于无知或是心怀恶意。

Children often behave badly out of/ through ignorance.

儿童往往出于无知而不守规矩。

Control system of the through-hole plating machine

孔金属化设备控制系统

Through hole filling is always a big challenge for wave soldering in multilayer PCB assembly, especially when encountering thick boards or components with large thermal dissipation.

钎料的通孔填充性问题一直是无铅波峰焊工艺在焊接双面板或多层板时一个很大的挑战，特别是遇到大厚板或者存在大吸热元件时填充不良现象尤为严峻。

The technology of the plating through hole of the printed circuit board was briefly introduced The plating through hole technology of the microwave printed circuit board were also illuminated.

本文在简单介绍印制板孔金属化加工技术的基础上，对微波印制板孔金属化加工技术进行了较为详细的论述。

The utility model is characterized in that an open drill is provided with a through hole in which an engaged positioning Kirschner pin is arranged.

在开口钻内设有一通孔，通孔内设有与其相配合的定位克氏针。

A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.

综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑&石墨层，以取代传统的化学镀铜工艺。

Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.

通过盘状及平面陈列陶瓷多层电容器的焊料所含的铅；

According to the factors of influencing the force of disassembly, the last chapter arranges the experiments about disassembling Through Hole Device with the Orthogonal Design Method.

根据影响拆除力的因素，用正交试验设计方法，安排拆卸插装元器件的实验。

Through hole drilling on the dam site, the physical and mechanical characteristics of the riverbed layer and the components of the layer material are studied.

通过现场勘探钻孔研究坝址区河床覆盖层的物理力学性质、物质组成等；

Wherein the floating plate is positioned in a water tank, which has a fixing piece and a through hole;

浮板，位于水箱内，浮板上设有固定件与透孔；

11950s: mass soldering for Through Hole Technology ( THT)& wave soldering appeared;

1950年代：通孔插装的群焊技术&波峰焊技术出现；

Combining ray tracing with algebraic reconstruction technique ( ART), ultrasonic Lamb wave tomography for through hole flaws is developed.

综合射线追踪与代数重建技术（ART），发展了横穿孔缺陷的超声兰姆波层析成像方法。

A converging through hole CBV is provided, which has better flow stopping performance and the lower fabricated difficulty.

提出一种收缩形通孔微阀，具有更好的流动控制性能，并且制作难度大大降低。

Through hole forming method, the hole sealing technique, hole cutting hole anti-reflection technology improvement, improve to the drilling effect.

并通过成孔方式、封孔技术、掏穴钻孔增透工艺的改进，提高了下向钻空效果。

Reason of Produce Haloing on Through Hole of the PCB

印制板通孔上晕圈产生的原因

The Analysis of the Plating Defects of Plated through Hole of the Multi-layer Printed Circuit Board and Countermeasures

多层印制板金属化孔镀层缺陷成因分析及相应对策