A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.

  • 综述了一种对印制线路板通孔镀的方法,即在孔壁上沉积有电镀用的碳黑&石墨层,以取代传统的化学镀铜工艺。

  • 互联网摘选 2026-05-07 14:19:30

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