词源词根法
来自古法语solder,连接,焊接,使成整体,来自拉丁语solidare,使成整体,词源同solid,完整的,整个的。
词组短语
solder joint软焊接合;钎焊接头;solder paste焊膏;焊锡膏
The solder wire should attain the standard provision deflection and pitch by straightening.
焊丝经校直应达到标准规定的挺度和翘距.
来源:网络文摘精选So it will result in rigidity skin & block and solder balls etc.
产生的后果是:锡膏出现硬皮 、 硬块、难熔并产生大量锡球等.
来源:网络文摘精选Application of Computer Graphic Technology in Measurement of Tin Solder Spreading Area
电脑图形处理技术在锡焊料铺展面积测量中的应用
来源:互联网摘选The second section will introduce the new slide valve and its application in Solder Paste process.
第二部分介绍最新的滑动阀科技及其在点锡膏中的应用.
来源:网络文摘精选理论模型也定量给出了焊膏厚度与焊点性能之间的关系.
来源:网络文摘精选Is the time recorded when the solder paster is taken out from the storage case?
焊贴从存储环境取出时的时间是否有记录?
来源:网络文摘精选PCBs are transported by a conveyor system over the preheat, solder and cooling stations.
电子线路板(PCB) 通过传送系统经过预热, 焊接和冷却区域.
来源:网络文摘精选We should the adhibit of solder paste before screen printing by automatic machine or by hand.
我们在进行锡膏印刷前应对锡膏进行一定的检测.如果没有专用设备也可以用以下的方法检查一下.
来源:网络文摘精选Interface void damage is the failure characteristic of solder joint under temperature cycling.
温度循环载荷可以在焊点界面处形成足以导致空洞损伤发生的高应力三轴度.
来源:网络文摘精选Careful tinning of the ends of wires results in a better joint when you solder them.
仔细对金属丝末端进行包锡有助于它们在焊接时很好地结合.
来源:网络文摘精选Oxide occurring after melting approximately 50 % less than common solder.
熔解后氧化物(锡渣)之发生量较一般焊锡减低近半.
来源:网络文摘精选Are LCD's and UCLA's defined for the average and range of Solder Paste measurements?
对锡膏厚度测量的平均值和间距是否定义了其控制上限和下限?
来源:网络文摘精选Do the supplies use magnifying glass to full check PCB solder connections?
供应商是否用放大镜全面检查PCB的焊点?
来源:网络文摘精选It's easy to learn to make a perfect solder joint when you use NIBCO Fittings.
如果使用美国尼伯科管件,很容易学会进行完美的焊料连接.
来源:网络文摘精选Is the average and range of Solder Paste height measurements SPC controlled?
锡膏厚度测量的平均值和间距SPC是否受控?
来源:互联网摘选If too much solder is used, it may flow past tube stop and clog sealing area.
如果使用的焊料太多, 那么有些焊料可能会流过管道阻挡部位,并堵塞密封区域.
来源:网络文摘精选Used with the solder wire together, soldering a stainless steel etc metal.
同锡线一起使用, 焊接不锈钢等难以上锡的金属.
来源:互联网摘选And techniques to make free solder bumping with electroplating are illustrated.
重点阐述了采用电镀制作无铅焊料凸点的方法.
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