electroplating的例句大全

Selection of Formulation of Combined Additives for Electroplating of Zinc-Nickel Alloy Coating from an Alkaline Bath

碱性体系中锌镍合金电镀添加剂复合配方优选

Copper Electroplating in Alkaline Bath Containing Novel Brightening Agent

采用新型组合光亮剂的碱性镀铜研究

In this article, the basic theory of Hull Cell Testing and its application in electroplating process for printing circuit board is explained.

本文主要阐述赫尔槽基本原理及其在印制电路板电镀过程中的应用。

The technics of chemical etching, chemical polishing and chromium electroplating for stainless steel mould were studied.

研究了不锈钢模具板的化学蚀刻 、 化学抛光和电镀铬工艺.

Determination of trace uranium in residual solution of electroplating standard uranium target by mass spectrometry isotope dilution

质谱同位素稀释法测量电镀标准铀靶残液中微量铀

Tianjin Electroplating Technical Committee and Its Major Activities

天津市电镀技术委员会及其主要活动

Technology of non-cyanide Cu-Zn-Sn-Ni tetrabasic alloy imitative gold electroplating on FRP was studied using potassium pyrophosphate as main complexing agent, potassium sodium tartrate as auxiliary complexing agent and laboratory-synthesized copper pyrophosphate and zinc pyrophosphate as main salts.

以焦磷酸钾为主络合剂、酒石酸钾钠为辅助络合剂，自制焦磷酸铜、焦磷酸锌为主盐进行了玻璃钢无氰Cu-Zn-Sn-Ni四元合金电镀工艺研究。

The lead-tin alloy layer is formed by adopting hot-dip plating instead of electroplating. The new technologies of hot-dip plating and manufacturing terminal post have been studied.

用热浸镀铅锡合金取代电镀铅锡合金，对热浸镀铅锡合金工艺及端极柱浇铸工艺进行了研究。

To introduce the process of thermodiffusion multiwire brass line. The calculation formula of electroplating, calculation methods of coat mass and coat compositions, usual scope of current density are given, and a practical calculation example is also given.

介绍热扩散法多丝电镀黄铜作业线的生产工艺，给出电镀电流的计算公式及镀层质量和镀层成分的计算方法及电流密度的正常范围，并举实例进行了计算。

Three-dimensional Design and Study of Optimization on Key Structures for ABS Automatic Plastics Electroplating Line

ABS全自动塑料电镀生产线三维设计及关键结构优化研究

Analysis of roughening solution for ABS plastics electroplating

ABS塑料电镀粗化溶液分析

Low Temperature Roughening of ABS Plastics With Chromic Acid Free Solution for Electroplating

ABS塑料电镀的低温无铬粗化

Thyristor power supply with ripple percentage equal to or less than 4.18% is suggested to meet anodizing and electroplating processes requirements.

认为晶闸管整流桥电镀电源需具有等于或小于4.18%的纹波因数值才能满足一些氧化和电镀工艺的要求。

High Solderability Tin alloy Electroplating Technology for Aluminum and Its Alloy

铝及铝合金电镀高可焊性锡基合金工艺

The proposed method has been successfully applied to the determination of Cu, Pb, Zn and Cd in tin basis alloy and waste water of electroplating.

本文提出的方法已成功地应用于锡基合金及电镀废水中铜、铅、锌和镉的测定，准确度好。

This article describes the determination of cobalt and stannous ions in black tin cobalt alloy electroplating baths by means of spectrophotometry. The effect of measuring wave length, oxidant, addition of potassium pyrophosphate, interfering elements and other affecting factors on the measured absorbance were investigated.

利用分光光度法测定锡钴合金镀液中钴（Ⅱ）和锡（Ⅱ）的含量，探讨了测量波长和氧化剂的选择、焦磷酸钾的加入量、干扰元素等对测量结果的影响。

Lead, tin and tin-lead alloy electroplating technologies using these two products are introduced.

介绍了采用两种产品的电镀铅、锡及铅-锡合金工艺。

Bright electroplating of tin-lead alloys

光亮铅-锡合金电镀

Elimination of excessive sulphate in acidic Tin electroplating

酸性镀锡中过量硫酸根的去除

Soldering Tin Electroplating of copper wire

铜线材电镀可焊性锡工艺