electroplating

And techniques to make free solder bumping with electroplating are illustrated.

重点阐述了采用电镀制作无铅焊料凸点的方法.

The proposed method has been successfully applied to the determination of Cu, Pb, Zn and Cd in tin basis alloy and waste water of electroplating.

本文提出的方法已成功地应用于锡基合金及电镀废水中铜、铅、锌和镉的测定，准确度好。

Electroplating , catalyst , and organic dyes . Making medicine, wood preservation etc.

用于铬电镀, 木材防腐工业.

Whisker problem must be firstly solved in developing a lead-free pure tin electroplating process.

开发无铅化纯锡电镀技术必须首先解决锡须问题。

Our products are widely used in Smelting, Chemical industry, Electroplating, Decorating etc.

我们的产品广泛应用于冶炼, 化工, 电镀, 装饰等.

Tin-bismuth alloy was electroplating by electrodepositing associated with ultrasonic agitation.

将超声和电沉积相结合电镀了锡铋合金.

Having pits on deposits is the common defect in electroplating processing.

镀层麻点是电镀加工的常见质量问题.

In printing, a duplicate letterpress plate made from an original by electroplating.

在印刷技术中, 一种用电镀方法从原版复制成的印刷版.

Lead, tin and tin-lead alloy electroplating technologies using these two products are introduced.

介绍了采用两种产品的电镀铅、锡及铅-锡合金工艺。

Processes which can lead to cathodic protection, phosphating, pickling, and electroplating.

阴极保护, 磷化反应, 酸洗和电镀都会造成氢脆变.

The effects of cerium on the parameter and capability of tin electroplating are discussed.

研究了镀液中铈盐含量不同时对电镀锡参数及性能的影响。

The development history of cyanide-free copper electroplating is briefly reviewed.

简要回顾了无氰碱性镀铜的发展历史.

Current trend of surface treatment technics in Japan Part ⅱ& Lead-free tin electroplating technics

日本表面处理技术近期动向&第二部分无铅镀锡技术

This article describes the determination of cobalt and stannous ions in black tin cobalt alloy electroplating baths by means of spectrophotometry. The effect of measuring wave length, oxidant, addition of potassium pyrophosphate, interfering elements and other affecting factors on the measured absorbance were investigated.

利用分光光度法测定锡钴合金镀液中钴（Ⅱ）和锡（Ⅱ）的含量，探讨了测量波长和氧化剂的选择、焦磷酸钾的加入量、干扰元素等对测量结果的影响。

The results show that current density, time of electroplating and concentration of plating solution component are key factors affecting the morphology and structure of composite coating.

实验结果表明：电流密度、埋砂时间、镀液成分浓度是影响Ni-SiC镀层形态与结构的显著因素，镀液温度对复合镀层形态与结构的影响不大。

Zinc-manganese alloy electroplating process and its researching trend were described.

介绍了锌锰合金电镀工艺的概况及研究方向.

An additive for matt pure tin electroplating was developed by electrochemical and chemical methods.

运用电化学和化学方法开发了一种亚光纯锡电镀添加剂。

A lot of sulfonated bodies applied in electroplating field were particularized.

列举了在电镀领域中实际应用到的各类磺化产物.

Process of non-bright tin electroplating and test of deposit performance

雾面锡电镀工艺及镀层性能测试

Of the total industrial cadmium use, 90 % is utilized in electroplating and pigments.

工业用镉总量的90%用于电镀和涂料.

High Solderability Tin alloy Electroplating Technology for Aluminum and Its Alloy

铝及铝合金电镀高可焊性锡基合金工艺

Technology of non-cyanide Cu-Zn-Sn-Ni tetrabasic alloy imitative gold electroplating on FRP was studied using potassium pyrophosphate as main complexing agent, potassium sodium tartrate as auxiliary complexing agent and laboratory-synthesized copper pyrophosphate and zinc pyrophosphate as main salts.

以焦磷酸钾为主络合剂、酒石酸钾钠为辅助络合剂，自制焦磷酸铜、焦磷酸锌为主盐进行了玻璃钢无氰Cu-Zn-Sn-Ni四元合金电镀工艺研究。

It was found that the additive could be well applied for bright tin electroplating.

结果显示，该添加剂在我公司的应用是比较成功的。

The major advantages and disadvantages of trivalent chromium electroplating were introduced.

介绍了三价铬镀铬的主要优点与缺点.

Effects of Cerium on the Parameter and Capability of Tin Electroplating

铈盐对电镀锡参数和性能的影响

Inside holding electroplating process is a precise technique in producing diamond reamer.

利用内镀方法制造金刚石铰刀是一种精密铰刀制造方法.

Bright electroplating of tin-lead alloys

光亮铅-锡合金电镀

Effects of pulse current on solderability of acidic tin electroplating

脉冲参数对可焊性镀锡层性能的影响

Electroplating troubles are greatly reduced by using the method in production.

生产中应用该方法后,电镀故障明显下降.

The effect of additives on zinc-nickel alloy electroplating was studied.

研究了添加剂在电镀锌 镍合金 中的作用.